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Electromigration Modeling at Circuit Layout Level - SpringerBriefs in Applied Sciences and Technology 2013 edition
Cher Ming Tan
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Electromigration Modeling at Circuit Layout Level - SpringerBriefs in Applied Sciences and Technology 2013 edition
Cher Ming Tan
Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels.
120 pages, 73 black & white illustrations, 2 colour illustrations, biography
| Media | Boeken Paperback Book (Boek met zachte kaft en gelijmde rug) |
| Vrijgegeven | 4 mei 2013 |
| ISBN13 | 9789814451208 |
| Uitgevers | Springer Verlag, Singapore |
| Pagina's | 103 |
| Afmetingen | 155 × 235 × 6 mm · 1,88 kg |
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