Vertel uw vrienden over dit artikel:
Solder Joint Reliability: Theory and Applications 1991 edition
John H. Lau
Solder Joint Reliability: Theory and Applications 1991 edition
John H. Lau
New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them.
631 pages, 146 black & white illustrations, biography
Media | Boeken Hardcover Book (Boek met harde rug en kaft) |
Vrijgegeven | 31 mei 1991 |
ISBN13 | 9780442002602 |
Uitgevers | Van Nostrand Reinhold Inc.,U.S. |
Pagina's | 631 |
Afmetingen | 155 × 235 × 34 mm · 975 g |
Taal en grammatica | Engels |
Alles tonen
Meer door John H. Lau
Bekijk alles van John H. Lau ( bijv. Hardcover Book , Paperback Book en Book )