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Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability Tae-Kyu Lee Softcover reprint of the original 1st ed. 2015 edition
Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability
Tae-Kyu Lee
This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys.
266 pages, 70 black & white illustrations, 81 colour illustrations, 18 black & white tables, biograp
| Media | Boeken Paperback Book (Boek met zachte kaft en gelijmde rug) |
| Vrijgegeven | 1 oktober 2016 |
| ISBN13 | 9781489978011 |
| Uitgevers | Springer-Verlag New York Inc. |
| Pagina's | 253 |
| Afmetingen | 150 × 220 × 10 mm · 508 g (Gewicht (geschat)) |
| Taal en grammatica | Engels |
Bekijk alles van Tae-Kyu Lee ( bijv. Hardcover Book en Paperback Book )
Kerstcadeautjes kunnen tot en met 31 januari worden ingewisseld